See-through-silicon inspection application studies
With semiconductor development processes hitting harder and harder on Moore’s law to continuously scale down, high density advanced packaging technologies…
All-surface Inspection for 3D-interconnects and TSV Manufacturing
APPLICATION NOTE All-surface Inspection for 3D-interconnects and TSV Manufacturing Rolf Shervey…
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Artificial intelligence and the changing costs and benefits of engaging…
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7th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2010
Green Mountain Monk
Buddhist monk originally from Sri Lanka and live in Green Mountains in Vermont..
System level evaluation of Silicon imager based see-through Silicon application
This paper first reviews the novel technology which enables the silicon based imagers (CCD or CMOS) for see-through silicon inspection applications..
Rolf Shervey: Embracing the Beauty of Nature and the Outdoors
Spending time in nature offers more than a brief escape…
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Rolf Shervey’s Tips for Building a Successful Career in the Semiconductor Industry
The semiconductor industry powers much of the modern world…